Multilevel using micromachining

The evolution of SMT technology and its SMD coatings, both in terms of miniaturisation and power, and combining them on electronic board designs, means that the volumes of paste required for each coating cannot be achieved with just one stencil thickness .

Multilevel stencils are designed and manufactured to use the same stencil printing process to print different thicknesses of solder paste, and to mask areas of the PCB such as graphite, silver bridges and tinted lines, enabling easy contact between the stencil and the PCB.

This type of stencil offers the ability to provide the specific and necessary volume to each type of component or coating.

We use several types of manufacturing technology, microsoldering and micromachining.

Our technical department can help you work out which technology will adapt best to each project and can manufacture these multilevel stencils by combining both technologies.

The multi-level micro-machining technology facilitates additional flexibility in both thicknesses and complex geometries, to meet the highest demands in controlled paste deposition.

Using a high-precision micromachining process, we grind down the material in the required areas, thereby adapting the stencil to different thicknesses, achieving the specific paste volumes as required.

• Tolerance +/-10um
• Can be applied on both sides of the stencil
• Complex geometries
• Progressive step ramp
• Step thicknesses can be defined according to the design: 20-500um
• Environmentally-friendly (chemical-free)