Vector Guard High tension

Vector Guard High Tension stencils are designed for very demanding fine grain solder paste applications.

Vector Guard High tension
Vector Guard High tension
Vector Guard High tension
Vector Guard High tension


Working with the Vector GuardTM High Tension tensioning system, Vector Guard High Tension stencils provide between 45-65% greater tension than a standard stencil. 

pecially recommended to meet solder paste depositing needs on components with the most demanding AR (area/ratio).

These exclusive tensioning characteristics for the High Tension model combine with the various benefits of the actual Vector GuardTM system, by also offering multiple stencils in a single tensioning frame.

Quick, precise stencil changing, no longer relying on opening- or groove-alignment.

Its aluminium border keeps the stencil rigid after tensioning, making it incredibly user-friendly, with greater protection against accidental cuts, and optimised storage space, approximately ¼ of standard rigid frame stencils.

  • Higher tension (45-65%) 
  • Recommended for demanding area/ratios
  • 4-sided mechanical tensioning system
  • Simple and fast stencil change
  • Less storage space required
  • Ergonomics and protection
  • Available in PHD and Fine Grain stainless steel
  • Thickness: 80um to 200um

Available formats: 

  • VG260 23x23” (584x584 mm), optional 736 mm adaptor.

Technologies and processes

EP-Gel electropolishing for SMD stencils reduces roughness around openings by improving how the paste is deposited on the PCB

Electropulido EP-Gel

Treating SMD stencils with a nanocoating improves the paste depositing process and requires fewer cleaning cycles.


Multilevel stencils using microsoldering offer greater control of the stencil printing process by using several thicknesses in the same stencil.

Multilevel (Microsoldadura)

The multi-level micro-machining technology facilitates additional flexibility in both thicknesses and complex geometries.

Multilevel (Micromecanizado)

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